Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Embalaje | Estado del producto | Tipo | Número de posiciones o clavijas (cuadrícula) | Paso: acoplamiento | Acabado de contacto: acoplamiento | Espesor del acabado del contacto: acoplamiento | Material del contacto: acoplamiento | Tipo de montaje | Características | Terminación | Paso: poste | Acabado del contacto: poste | Espesor del acabado del contacto: poste | Material del contacto: Poste | Material de la carcasa | Temperatura de funcionamiento |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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2485264-1DIP IC SOCKET 8P,GOLD FLASH TE Connectivity AMP Connectors |
4,766 |
|
![]() Tabla de datos |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
1-2199299-540P,DIP SKT,600 CL,LDR,PB FREE TE Connectivity AMP Connectors |
2,339 |
|
![]() Tabla de datos |
Diplomate DL | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Nickel | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
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2041549-1SOCKET ASSY, DMD 350, T/R, G/F TE Connectivity AMP Connectors |
442 |
|
![]() Tabla de datos |
DMD | Tape & Reel (TR) | Active | PGA, ZIF (ZIP) | 350 (35 x 36) | 0.050" (1.27mm) | Gold | Flash | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | - | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | -55°C ~ 105°C |
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1-2324271-3RIGHT SEGMEN LGA4189-4 SOCKET-P4 TE Connectivity AMP Connectors |
4,159 |
|
![]() Tabla de datos |
- | Tray | Active | LGA 4189 | 2092 | 0.039" (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034" (0.86mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic | -25°C ~ 100°C |
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1-2324271-2LEFT SEGMEN LGA4189-4 SOCKET-P4 TE Connectivity AMP Connectors |
3,756 |
|
![]() Tabla de datos |
- | Tray | Active | LGA 4189 | 2092 | 0.039" (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034" (0.86mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic | -25°C ~ 100°C |
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1-2324271-1RIGHT SEGMEN LGA4189-4 SOCKET-P4 TE Connectivity AMP Connectors |
215 |
|
![]() Tabla de datos |
- | Tray | Active | LGA 4189 | 2092 | 0.039" (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034" (0.86mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic | -25°C ~ 100°C |
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2350616-1DUAL LGA,250 POS, DMD SOCKET TE Connectivity AMP Connectors |
296 |
|
![]() Tabla de datos |
- | Tray | Active | LGA | 250 (16 x 25) | 0.039" (1.00mm) | Gold | 3.00µin (0.076µm) | Copper Alloy | Surface Mount | Board Guide, Open Frame | Solder | - | - | - | - | Thermoplastic | -25°C ~ 100°C |
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1-2324271-4LEFT SEGMEN LGA4189-4 SOCKET-P4 TE Connectivity AMP Connectors |
121 |
|
![]() Tabla de datos |
- | Tray | Active | LGA 4189 | 2092 | 0.039" (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034" (0.86mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic | -25°C ~ 100°C |
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2-2129710-5CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors |
171 |
|
![]() Tabla de datos |
- | Tray | Last Time Buy | LGA | 3647 | - | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Thermoplastic | - |
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2-2129710-6CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors |
249 |
|
![]() Tabla de datos |
- | Tray | Last Time Buy | LGA | 3647 | - | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Thermoplastic | - |