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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    XR2A-2811-N

    XR2A-2811-N

    CONN IC DIP SOCKET 28POS GOLD

    Omron Electronics Inc-EMC Div

    0
    RFQ
    XR2A-2811-N

    Tabla de datos

    XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2A-2471-N

    XR2A-2471-N

    IC CONNECTOR

    Omron Electronics Inc-EMC Div

    0
    RFQ

    -

    * Bulk Active - - - - - - - - - - - - - - -
    XR2A-2401-N

    XR2A-2401-N

    CONN IC DIP SOCKET 24POS GOLD

    Omron Electronics Inc-EMC Div

    0
    RFQ
    XR2A-2401-N

    Tabla de datos

    XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2A-3211-N

    XR2A-3211-N

    CONN IC DIP SOCKET 32POS GOLD

    Omron Electronics Inc-EMC Div

    0
    RFQ
    XR2A-3211-N

    Tabla de datos

    XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2A-2025

    XR2A-2025

    CONN IC DIP SOCKET 20POS GOLD

    Omron Electronics Inc-EMC Div

    0
    RFQ
    XR2A-2025

    Tabla de datos

    XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2A-2801-N

    XR2A-2801-N

    CONN IC DIP SOCKET 28POS GOLD

    Omron Electronics Inc-EMC Div

    0
    RFQ
    XR2A-2801-N

    Tabla de datos

    XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2A-3221-N

    XR2A-3221-N

    CONN IC DIP SOCKET 32POS GOLD

    Omron Electronics Inc-EMC Div

    0
    RFQ
    XR2A-3221-N

    Tabla de datos

    XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2C-3215

    XR2C-3215

    CONN SOCKET SIP 32POS GOLD

    Omron Electronics Inc-EMC Div

    0
    RFQ
    XR2C-3215

    Tabla de datos

    XR2 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2T-2401-N

    XR2T-2401-N

    CONN IC DIP SOCKET 24POS GOLD

    Omron Electronics Inc-EMC Div

    0
    RFQ
    XR2T-2401-N

    Tabla de datos

    XR2 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Threaded Open Frame Solder 0.100" (2.54mm) Gold 29.5µin (0.75µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2T-2411-N

    XR2T-2411-N

    CONN IC DIP SOCKET 24POS GOLD

    Omron Electronics Inc-EMC Div

    0
    RFQ
    XR2T-2411-N

    Tabla de datos

    XR2 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    Total 63 Record«Prev1234567Next»
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