KATY Electronic Technology Co., LTD - Soldadura - Productos para soldadura, desoldadura y retrabajo - página 13 - Fuente original de productos

N.º de Parte del Fabricante	Disponibilidad	Precio	Cantidad	Hoja de Datos	Serie	Embalaje	Estado del producto	Tipo	Composición	Diámetro	Punto de fusión	Tipo de fundente	Calibre del cable	Tipo de malla	Proceso	Forma	Vida útil	Inicio de vida útil	Temperatura de almacenamiento/refrigeración
SMD291SNL10 SOLDER PASTE NO-CLEAN 10CC SYR Chip Quik Inc.	35	-	RFQ	Tabla de datos	-	Dispenser	Active	Solder Paste	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	-	423 ~ 428°F (217 ~ 220°C)	No-Clean	-	3	Lead Free	Syringe, 1.23 oz (35g), 10cc	6 Months	Date of Manufacture	37°F ~ 46°F (3°C ~ 8°C)
TS391LT10 THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc.	36	-	RFQ	Tabla de datos	-	Bulk	Active	Solder Paste	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	-	281°F (138°C)	No-Clean	-	4	Lead Free	Syringe, 1.23 oz (35g), 10cc	12 Months	Date of Manufacture	68°F ~ 77°F (20°C ~ 25°C)
397952 HMP 366 3% .022DIA. 23AWG Harimatec Inc.	45	-	RFQ	Tabla de datos	366	Bulk	Active	Wire Solder	Pb93.5Sn5Ag1.5 (93.5/5/1.5)	0.022" (0.56mm)	565 ~ 574°F (296 ~ 301°C)	Rosin Activated (RA)	23 AWG, 24 SWG	-	Leaded	Spool, 8.8 oz (250g)	-	-	-
SMDIN66.3BI33.7 INDIUM/BISMUTH SOLDER WIRE (IN66 Chip Quik Inc.	36	-	RFQ	Tabla de datos	CHIPQUIK®	Bulk	Active	Wire Solder	In66.3Bi33.7 (66.3/33.7)	0.031" (0.79mm)	162°F (72°C)	-	-	-	Lead Free	Spool	60 Months	Date of Manufacture	-
SMDSWLF.031 4OZ SLD WIRE NO-CLEAN 96.5/3/.5 4OZ. Chip Quik Inc.	32	-	RFQ	Tabla de datos	-	Spool	Active	Wire Solder	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	0.031" (0.79mm)	423 ~ 428°F (217 ~ 220°C)	No-Clean, Water Soluble	20 AWG, 22 SWG	-	Lead Free	Spool, 4 oz (113.40g)	-	-	-
386844 63/37 400 2% .015DIA 27AWG Harimatec Inc.	31	-	RFQ	Tabla de datos	C400	Bulk	Active	Wire Solder	Sn63Pb37 (63/37)	0.015" (0.38mm)	361°F (183°C)	No-Clean	27 AWG, 28 SWG	-	Leaded	Spool, 8.8 oz (250g)	-	-	59°F ~ 86°F (15°C ~ 30°C)
SMDLTLFP10T5 SOLDER PASTE LOW TEMP LF T5 10CC Chip Quik Inc.	40	-	RFQ	Tabla de datos	-	Dispenser	Active	Solder Paste	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	-	281°F (138°C)	No-Clean	-	5	Lead Free	Syringe, 1.23 oz (35g), 10cc	6 Months	Date of Manufacture	37°F ~ 46°F (3°C ~ 8°C)
389261 60/40 370 3% .015DIA 27AWG Harimatec Inc.	79	-	RFQ	Tabla de datos	370	Bulk	Active	Wire Solder	Sn60Pb40 (60/40)	0.015" (0.38mm)	361 ~ 374°F (183 ~ 190°C)	Rosin Activated (RA)	27 AWG, 28 SWG	-	Leaded	Spool, 8.8 oz (250g)	-	-	-
4860P-35G LEADED NO CLEAN SOLDER PASTE MG Chemicals	91	-	RFQ	Tabla de datos	4860	Dispenser	Active	Solder Paste	Sn63Pb37 (63/37)	-	361°F (183°C)	No-Clean	-	3	Leaded	Syringe, 1.23 oz (35g), 10cc	24 Months	Date of Manufacture	39°F ~ 50°F (4°C ~ 10°C)
SMDSWLTLFP32 SOLDER WIRE LOW TEMP 42/57/1 32' Chip Quik Inc.	85	-	RFQ	Tabla de datos	-	Bulk	Active	Wire Solder	Bi57Sn42Ag1 (57/42/1)	0.030" (0.76mm)	280°F (138°C)	-	21 AWG, 22 SWG	-	Lead Free	-	-	-	-
SMD291SNL10T5 SOLDER PASTE LF T5 10CC Chip Quik Inc.	10	-	RFQ	Tabla de datos	-	Dispenser	Active	Solder Paste	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	-	423 ~ 428°F (217 ~ 220°C)	No-Clean	-	5	Lead Free	Syringe, 1.23 oz (35g), 10cc	6 Months	Date of Manufacture	37°F ~ 46°F (3°C ~ 8°C)
4900P-25G LEAD FREE NO CLEAN SOLDER PASTE MG Chemicals	100	-	RFQ	Tabla de datos	4900	Bulk	Active	Solder Paste	Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4)	-	423 ~ 430°F (217 ~ 221°C)	No-Clean	-	-	Lead Free	Syringe, 0.88 oz (25g)	24 Months	Date of Manufacture	39°F ~ 50°F (4°C ~ 10°C)
SMD291AX250T3 SOLDER PASTE SN63/PB37 250G Chip Quik Inc.	38	-	RFQ	Tabla de datos	-	Bulk	Active	Solder Paste	Sn63Pb37 (63/37)	-	361°F (183°C)	No-Clean	-	3	Leaded	Jar, 8.8 oz (250g)	12 Months	Date of Manufacture	37°F ~ 46°F (3°C ~ 8°C)
4875-227G SOLDER NO-CLEAN 60/40 1/2 LB MG Chemicals	27	-	RFQ	Tabla de datos	4870	Spool	Active	Wire Solder	Sn60Pb40 (60/40)	0.032" (0.81mm)	361 ~ 376°F (183 ~ 191°C)	No-Clean	20 AWG, 21 SWG	-	Leaded	Spool, 8 oz (227g), 1/2 lb	60 Months	Date of Manufacture	50°F ~ 86°F (10°C ~ 30°C)
70-1708-0520 SOLDERPASTE WATER SOL SYR 35GM Kester Solder	67	-	RFQ	Tabla de datos	R500	Dispenser	Active	Solder Paste	Sn63Pb37 (63/37)	-	361°F (183°C)	Water Soluble	-	3	Leaded	Syringe, 1.23 oz (35g), 10cc	6 Months	Date of Manufacture	32°F ~ 50°F (0°C ~ 10°C)
BARSN99.3CU0.7 SOLDER BAR SN99.3/CU0.7 1LB SUPE Chip Quik Inc.	28	-	RFQ	Tabla de datos	Super Low Dross™	Bulk	Active	Bar Solder	Sn99.3Cu0.7 (99.3/0.7)	-	441°F (227°C)	-	-	-	Lead Free	Bar, 1 lb (454g)	-	-	-
395439 HMP 366 3% .050DIA 16AWG Harimatec Inc.	30	-	RFQ	Tabla de datos	366	Bulk	Active	Wire Solder	Pb93.5Sn5Ag1.5 (93.5/5/1.5)	0.050" (1.27mm)	565 ~ 574°F (296 ~ 301°C)	Rosin Activated (RA)	16 AWG, 18 SWG	-	Leaded	Spool, 17.64 oz (500g)	-	-	-
395437 HMP 366 3% .028DIA 21AWG Harimatec Inc.	89	-	RFQ	Tabla de datos	366	Bulk	Active	Wire Solder	Pb93.5Sn5Ag1.5 (93.5/5/1.5)	0.028" (0.71mm)	565 ~ 574°F (296 ~ 301°C)	Rosin Activated (RA)	21 AWG, 22 SWG	-	Leaded	Spool, 17.64 oz (500g)	-	-	-
386827 60/40 370 3% .032DIA 20AWG Harimatec Inc.	6	-	RFQ	Tabla de datos	370	Bulk	Active	Wire Solder	Sn60Pb40 (60/40)	0.032" (0.81mm)	361 ~ 374°F (183 ~ 190°C)	Rosin Activated (RA)	20 AWG, 21 SWG	-	Leaded	Spool, 17.64 oz (500g)	-	-	-
SMD291SNL250T3 SOLDER PASTE SAC305 250G T3 Chip Quik Inc.	6	-	RFQ	Tabla de datos	-	Bulk	Active	Solder Paste	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	-	423 ~ 428°F (217 ~ 220°C)	No-Clean	-	3	Lead Free	Jar, 8.8 oz (250g)	6 Months	Date of Manufacture	37°F ~ 46°F (3°C ~ 8°C)

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