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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Disipadores de calor

    制造商 Serie Embalaje Estado del producto Tipo Paquete refrigerado Método de fijación Forma Longitud Ancho Diámetro Altura de la aleta Disipación de energía a aumento de temperatura Resistencia térmica a flujo de aire forzado Resistencia térmica a natural Material Acabado del 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    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Paquete refrigerado Método de fijación Forma Longitud Ancho Diámetro Altura de la aleta Disipación de energía a aumento de temperatura Resistencia térmica a flujo de aire forzado Resistencia térmica a natural Material Acabado del material
    V7466Z

    V7466Z

    HEATSINK ALUM ANOD

    Assmann WSW Components

    1,386
    RFQ
    V7466Z

    Tabla de datos

    - Tray Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Bolt On and PC Pin Square, Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.500" (12.70mm) - - 5.60°C/W Aluminum Black Anodized
    634-15ABPE

    634-15ABPE

    HEATSINK SLIM VERT BLACK TO-220

    Wakefield-Vette

    2,519
    RFQ
    634-15ABPE

    Tabla de datos

    634 Box Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.500" (38.10mm) 0.640" (16.26mm) - 0.640" (16.26mm) 3.0W @ 50°C 2.00°C/W @ 300 LFM 50.00°C/W Aluminum Black Anodized
    575200B00000G

    575200B00000G

    HEATSINK TO-92 .72" BLK

    Boyd Laconia, LLC

    2,993
    RFQ
    575200B00000G

    Tabla de datos

    - Bag Active Board Level, Vertical TO-92 Press Fit Rectangular, Fins 0.602" (15.29mm) - - 0.720" (18.29mm) 0.3W @ 20°C 17.50°C/W @ 400 LFM 60.00°C/W Aluminum Black Anodized
    624-45ABT3

    624-45ABT3

    HEATSINK CPU 21MM SQ W/ADH BLK

    Wakefield-Vette

    14,121
    RFQ
    624-45ABT3

    Tabla de datos

    624 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.450" (11.43mm) - 15.00°C/W @ 200 LFM - Aluminum Black Anodized
    574402B03200G

    574402B03200G

    HEATSINK TO220 HOR MNT W/TAB.75"

    Boyd Laconia, LLC

    3,374
    RFQ
    574402B03200G

    Tabla de datos

    - Bulk Active Board Level TO-220 Clip and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.860" (21.84mm) - 0.395" (10.03mm) 3.0W @ 60°C 12.00°C/W @ 200 LFM 23.20°C/W Aluminum Black Anodized
    RA-T2X-25E

    RA-T2X-25E

    HEATSINK TO-218,TO-220,TO-247

    Ohmite

    330
    RFQ
    RA-T2X-25E

    Tabla de datos

    R Box Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 1.654" (42.00mm) 0.985" (25.00mm) - 1.000" (25.40mm) 2.0W @ 20°C 1.50°C/W @ 200 LFM 4.80°C/W Aluminum Black Anodized
    531102B02500G

    531102B02500G

    HEATSINK TO-220 W/PINS 1.5"TALL

    Boyd Laconia, LLC

    1,329
    RFQ
    531102B02500G

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.500" (38.10mm) 1.375" (34.93mm) - 0.500" (12.70mm) 7.0W @ 70°C 3.00°C/W @ 500 LFM 10.40°C/W Aluminum Black Anodized
    WA-T220-101E

    WA-T220-101E

    HEATSINK AND CLIP FOR TO-220 BLK

    Ohmite

    2,018
    RFQ
    WA-T220-101E

    Tabla de datos

    W Tray Active Board Level, Vertical TO-220 Clip and PC Pin Rectangular, Fins 1.201" (30.50mm) 0.720" (18.29mm) - 0.630" (16.00mm) 1.0W @ 20°C - 12.00°C/W Aluminum Black Anodized
    529901B02500G

    529901B02500G

    HEATSINK TO-218 SOLDER PIN

    Boyd Laconia, LLC

    225
    RFQ
    529901B02500G

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-218 Bolt On and PC Pin Rectangular, Fins 2.000" (50.80mm) 1.650" (41.91mm) - 1.000" (25.40mm) 12.0W @ 50°C 1.00°C/W @ 800 LFM 4.50°C/W Aluminum Black Anodized
    DA-T263-101E-TR

    DA-T263-101E-TR

    TO-263 HEAT SINK / POLY TAPE

    Ohmite

    504
    RFQ
    DA-T263-101E-TR

    Tabla de datos

    D Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) Solderable Feet Rectangular, Fins 0.500" (12.70mm) 1.020" (25.91mm) - 0.400" (10.16mm) 2.0W @ 30°C 8.00°C/W @ 500 LFM - Aluminum Black Anodized
    576802B00000G

    576802B00000G

    HEATSINK TO-220 5W BLK

    Boyd Laconia, LLC

    8,323
    RFQ
    576802B00000G

    Tabla de datos

    - Bag Active Board Level TO-220, TO-262 Clip Rectangular, Fins 0.750" (19.05mm) 0.500" (12.70mm) - 0.500" (12.70mm) 1.5W @ 40°C 7.00°C/W @ 400 LFM 27.30°C/W Aluminum Black Anodized
    DA-T263-201E-TR

    DA-T263-201E-TR

    HEATSINK FOR TO-263

    Ohmite

    1,390
    RFQ
    DA-T263-201E-TR

    Tabla de datos

    D Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) Solderable Feet Rectangular, Fins 0.500" (12.70mm) 1.020" (25.91mm) - 0.480" (12.19mm) 2.0W @ 30°C 8.00°C/W @ 500 LFM - Aluminum Black Anodized
    658-60ABT1E

    658-60ABT1E

    HEATSINK CPU 28MM SQ BLK W/TAPE

    Wakefield-Vette

    16,874
    RFQ
    658-60ABT1E

    Tabla de datos

    658 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.600" (15.24mm) 2.5W @ 30°C 2.00°C/W @ 500 LFM - Aluminum Black Anodized
    BDN09-3CB/A01

    BDN09-3CB/A01

    HEATSINK CPU W/ADHESIVE .91"SQ

    CTS Thermal Management Products

    3,542
    RFQ
    BDN09-3CB/A01

    Tabla de datos

    BDN Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 0.910" (23.11mm) 0.910" (23.11mm) - 0.355" (9.02mm) - 9.60°C/W @ 400 LFM 26.90°C/W Aluminum Black Anodized
    6236BG

    6236BG

    HEATSINK TO-220 CLIP-ON BLACK

    Boyd Laconia, LLC

    1,440
    RFQ
    6236BG

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-220 Clip Rectangular, Fins 0.700" (17.78mm) 0.520" (13.21mm) - 0.510" (12.95mm) 2.0W @ 50°C 12.00°C/W @ 300 LFM 25.00°C/W Aluminum Black Anodized
    7106DG

    7106DG

    BOARD LEVEL HEATSINK .375" D2PAK

    Boyd Laconia, LLC

    13,259
    RFQ
    7106DG

    Tabla de datos

    - Bulk Active Top Mount TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10 SMD Pad Rectangular, Fins 0.591" (15.00mm) 1.020" (25.91mm) - 0.375" (9.52mm) 2.0W @ 40°C 5.00°C/W @ 400 LFM - Copper Tin
    BDN10-3CB/A01

    BDN10-3CB/A01

    HEATSINK CPU W/ADHESIVE 1.01"SQ

    CTS Thermal Management Products

    780
    RFQ
    BDN10-3CB/A01

    Tabla de datos

    BDN Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.010" (25.65mm) 1.010" (25.65mm) - 0.355" (9.02mm) - 8.00°C/W @ 400 LFM 26.40°C/W Aluminum Black Anodized
    592502B03400G

    592502B03400G

    HEATSINK TO-220 VERT MNT W/TABS

    Boyd Laconia, LLC

    14,142
    RFQ
    592502B03400G

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.250" (31.75mm) 0.874" (22.20mm) - 0.250" (6.35mm) 1.0W @ 30°C 10.00°C/W @ 200 LFM 22.00°C/W Aluminum Black Anodized
    322605B00000G

    322605B00000G

    HEATSINK TO-5 1.25W H=.25" BLK

    Boyd Laconia, LLC

    1,057
    RFQ
    322605B00000G

    Tabla de datos

    - Bag Active Top Mount TO-5 Press Fit Cylindrical - - 0.315" (8.00mm) ID, 0.750" (19.05mm) OD 0.250" (6.35mm) 1.0W @ 60°C 25.00°C/W @ 200 LFM 54.00°C/W Aluminum Black Anodized
    529802B02500G

    529802B02500G

    HEATSINK TO-220 W/PINS 1.5"TALL

    Boyd Laconia, LLC

    7,718
    RFQ
    529802B02500G

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.500" (38.10mm) 10.0W @ 50°C 3.00°C/W @ 200 LFM 3.70°C/W Aluminum Black Anodized
    Total 122183 Record«Prev123456...6110Next»
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