Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Paquete/Caja | Embalaje | Estado del producto | Aplicaciones | Corriente - Suministro | Voltaje - Suministro | Temperatura de funcionamiento | Grado | Calificación | Tipo de montaje | Proveedor Dispositivo Paquete |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MPF5023AMBA0ESPOWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
490 |
|
- |
- | 40-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | 10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | - | - | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
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MFS2401AVBA0ESMFS2401AVBA0ES NXP USA Inc. |
490 |
|
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- | 32-VFQFN Exposed Pad | Bulk | Active | System Basis Chip | - | 5.5V ~ 40V | -40°C ~ 115°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 32-HVQFN (5x5) |
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MFS2401AVBA1ESSafety Mini CAN FD SBC NXP USA Inc. |
135 |
|
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- | 32-VFQFN Exposed Pad | Tray | Active | System Basis Chip | - | 5.5V ~ 40V | -40°C ~ 115°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 32-HVQFN (5x5) |
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MC34PF1550A0EPPOWER MANAGEMENT IC 3 BUCK REGS NXP USA Inc. |
490 |
|
- |
- | 40-VFQFN Exposed Pad | Tray | Active | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | - | - | Surface Mount | 40-HVQFN (5x5) |
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MC34PF1550A1EPPOWER MANAGEMENT IC: 3 BUCK REGS NXP USA Inc. |
490 |
|
- |
- | 40-VFQFN Exposed Pad | Tray | Active | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | - | - | Surface Mount | 40-HVQFN (5x5) |
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MC34PF1550A2EPPOWER MANAGEMENT IC: 3 BUCK REGS NXP USA Inc. |
490 |
|
- |
- | 40-VFQFN Exposed Pad | Tray | Active | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | - | - | Surface Mount | 40-HVQFN (5x5) |
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MC34PF1550A3EPPOWER MANAGEMENT IC: 3 BUCK REGS NXP USA Inc. |
490 |
|
- |
- | 40-VFQFN Exposed Pad | Tray | Active | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | - | - | Surface Mount | 40-HVQFN (5x5) |
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MFS2320BMBA0EPMFS2320BMBA0EP NXP USA Inc. |
255 |
|
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- | 48-VFQFN Exposed Pad | Tray | Active | System Basis Chip | 30µA | 5.5V ~ 40V | -40°C ~ 125°C (TA) | - | - | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
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MC33FS4500NAESYSTEM BASIS CHIP LINEAR 0.5A V NXP USA Inc. |
250 |
|
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- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
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MPF5023CMBA0ESPOWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
490 |
|
![]() Tabla de datos |
- | 40-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | 200µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |