Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Paquete/Caja | Embalaje | Estado del producto | Aplicaciones | Corriente - Suministro | Voltaje - Suministro | Temperatura de funcionamiento | Grado | Calificación | Tipo de montaje | Proveedor Dispositivo Paquete |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MC33FS6525CAESYSTEM BASIS CHIP, DCDC 2.2A VCO NXP USA Inc. |
250 |
|
![]() Tabla de datos |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MFS2633AMBA0ADSAFETY SYSTEM BASIS CHIP WITH LO NXP USA Inc. |
239 |
|
![]() Tabla de datos |
- | 48-LQFP Exposed Pad | Tray | Active | - | 29µA | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) |
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MPF5030BMBA0ESPMIC 3 BUCKS 2 LDO A1 DIE NXP USA Inc. |
243 |
|
![]() Tabla de datos |
- | 40-PowerVFQFN | Tray | Active | System Basis Chip | - | 3.3V ~ 5.25V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
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MC33FS6515NAESYSTEM BASIS CHIP, DCDC 1.5A VCO NXP USA Inc. |
250 |
|
![]() Tabla de datos |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33FS6510NAESYSTEM BASIS CHIP DCDC 1.5A VCO NXP USA Inc. |
250 |
|
![]() Tabla de datos |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
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MFS2613AMDDCADSAFETY SYSTEM BASIS CHIP WITH LO NXP USA Inc. |
230 |
|
![]() Tabla de datos |
- | 48-LQFP Exposed Pad | Tray | Active | - | - | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) |
![]() |
MFS2613AMDA6ADSAFETY SYSTEM BASIS CHIP WITH LO NXP USA Inc. |
150 |
|
![]() Tabla de datos |
- | 48-LQFP Exposed Pad | Tray | Active | - | - | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) |
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MPF7100BVMA1ESPF7100 PMIC I.MX8XL NXP USA Inc. |
260 |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | 10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
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MC33FS6520NAESYSTEM BASIS CHIP DCDC 2.2A VCO NXP USA Inc. |
250 |
|
![]() Tabla de datos |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
![]() |
MC33FS6525NAESYSTEM BASIS CHIP, DCDC 2.2A VCO NXP USA Inc. |
250 |
|
![]() Tabla de datos |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |