Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Embalaje | Estado del producto | Tipo | Número de posiciones o clavijas (cuadrícula) | Paso: acoplamiento | Acabado de contacto: acoplamiento | Espesor del acabado del contacto: acoplamiento | Material del contacto: acoplamiento | Tipo de montaje | Características | Terminación | Paso: poste | Acabado del contacto: poste | Espesor del acabado del contacto: poste | Material del contacto: Poste | Material de la carcasa | Temperatura de funcionamiento |
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268-5401-50-11023M TEXTOOL OEM LCC SOCKETS 268-5 3M |
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Textool™ | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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220-4842-00-3303CONN IC DIP SOCKET ZIF 20POS GLD 3M |
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OEM | Bulk | Obsolete | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Polyether Imide (PEI), Glass Filled | -55°C ~ 105°C |
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268-5401-00-1102JHCONN SOCKET CLCC 68POS GOLD 3M |
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OEM | Tray | Obsolete | CLCC | 68 (4 x 17) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | -55°C ~ 105°C |
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240-4846-00-3303CONN IC DIP SOCKET ZIF 40POS GLD 3M |
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OEM | Bulk | Obsolete | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Polyether Imide (PEI), Glass Filled | -55°C ~ 105°C |
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71002651493MTEXTOOLRECEPTACLES FOR DIP SOC 3M |
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- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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200-6325-NUN-8100CAMLEVER-STANDARD 3M |
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Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 625 (25 x 25) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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232-1291-00-0602JCONN IC DIP SOCKET ZIF 32POS GLD 3M |
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Textool™ | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
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7100265148TEXTOOLRECEPTACLES FOR DIP SOCKE 3M |
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- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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210-2599-50-06023M TEXTOOL ZIP STRIP SOCKETS 210 3M |
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Textool™ | Box | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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232-1270-01-0602CONN SOCKET PGA ZIF 32POS GOLD 3M |
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![]() Tabla de datos |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |