Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Embalaje | Estado del producto | Tipo | Número de posiciones o clavijas (cuadrícula) | Paso: acoplamiento | Acabado de contacto: acoplamiento | Espesor del acabado del contacto: acoplamiento | Material del contacto: acoplamiento | Tipo de montaje | Características | Terminación | Paso: poste | Acabado del contacto: poste | Espesor del acabado del contacto: poste | Material del contacto: Poste | Material de la carcasa | Temperatura de funcionamiento |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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272-6325-9UA-1902TEST BURN-IN PGA 3M |
0 |
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![]() Tabla de datos |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 72 (25 x 25) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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2184-6325-9UA-1902TEST BURN-IN PGA 3M |
0 |
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![]() Tabla de datos |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 184 (25 x 25) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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2141-6321-9UA-1902TEST AND BURN-IN PGA 3M |
0 |
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Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 141 (21 x 21) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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2192-6325-9UA-1902TEST BURN-IN PGA 3M |
0 |
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![]() Tabla de datos |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 192 (25 x 25) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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2280-6319-9UA-1902TEXTOOL 3M |
0 |
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![]() Tabla de datos |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 280 (19 x 19) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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2145-6315-9UA-1902BURN-IN GRID ZIP SOCKET 3M |
0 |
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Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 145 (15 x 15) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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256-6313-9UA-1902PGA 13 X 13 3M |
0 |
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![]() Tabla de datos |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 56 (13 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |