Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Embalaje | Estado del producto | Tipo | Número de posiciones o clavijas (cuadrícula) | Paso: acoplamiento | Acabado de contacto: acoplamiento | Espesor del acabado del contacto: acoplamiento | Material del contacto: acoplamiento | Tipo de montaje | Características | Terminación | Paso: poste | Acabado del contacto: poste | Espesor del acabado del contacto: poste | Material del contacto: Poste | Material de la carcasa | Temperatura de funcionamiento |
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100-032-050CONN IC DIP SOCKET 32POS GOLD 3M |
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100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-032-051CONN IC DIP SOCKET 32POS GOLD 3M |
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![]() Tabla de datos |
100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-040-050CONN IC DIP SOCKET 40POS GOLD 3M |
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100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-040-051CONN IC DIP SOCKET 40POS GOLD 3M |
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![]() Tabla de datos |
100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-042-050CONN IC DIP SOCKET 42POS GOLD 3M |
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100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-048-050CONN IC DIP SOCKET 48POS GOLD 3M |
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100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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CUSTOM BGACONN SOCKET BGA CUSTOM 3M |
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Textool™ | - | Active | BGA | Custom | 0.026" ~ 0.050" (0.65mm ~ 1.27mm) | Custom | Custom | - | Through Hole | Custom | - | - | - | - | - | - | - |
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234-3034-51-0602CONN ZIG-ZAG ZIF 34POS GOLD 3M |
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Textool™ | Bulk | Discontinued at Digi-Key | Zig-Zag, ZIF (ZIP) | 34 (2 x 17) | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
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268-4204-013M TEXTOOL OPEN-TOP SOCKETS FOR 3M |
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Textool™ | Box | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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2A8-4204-003M TEXTOOL OPEN-TOP SOCKETS FOR 3M |
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Textool™ | Box | Discontinued at Digi-Key | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |