Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Embalaje | Estado del producto | Tipo | Número de posiciones o clavijas (cuadrícula) | Paso: acoplamiento | Acabado de contacto: acoplamiento | Espesor del acabado del contacto: acoplamiento | Material del contacto: acoplamiento | Tipo de montaje | Características | Terminación | Paso: poste | Acabado del contacto: poste | Espesor del acabado del contacto: poste | Material del contacto: Poste | Material de la carcasa | Temperatura de funcionamiento |
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100-016-001CONN IC DIP SOCKET 16POS GOLD 3M |
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100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-018-000CONN IC DIP SOCKET 18POS GOLD 3M |
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100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-020-000CONN IC DIP SOCKET 20POS GOLD 3M |
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100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-020-001CONN IC DIP SOCKET 20POS GOLD 3M |
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100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-022-000CONN IC DIP SOCKET 22POS GOLD 3M |
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100 | Bulk | Obsolete | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-024-000CONN IC DIP SOCKET 24POS GOLD 3M |
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100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-024-001CONN IC DIP SOCKET 24POS GOLD 3M |
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100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-028-000CONN IC DIP SOCKET 28POS GOLD 3M |
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100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-028-001CONN IC DIP SOCKET 28POS GOLD 3M |
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100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-032-000CONN IC DIP SOCKET 32POS GOLD 3M |
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100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |