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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Disipadores de calor

    制造商 Serie Embalaje Estado del producto Tipo Paquete refrigerado Método de fijación Forma Longitud Ancho Diámetro Altura de la aleta Disipación de energía a aumento de temperatura Resistencia térmica a flujo de aire forzado Resistencia térmica a natural Material Acabado del 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    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Paquete refrigerado Método de fijación Forma Longitud Ancho Diámetro Altura de la aleta Disipación de energía a aumento de temperatura Resistencia térmica a flujo de aire forzado Resistencia térmica a natural Material Acabado del material
    577002B00000G

    577002B00000G

    HEAT SINK TO-220 .250" COMPACT

    Boyd Laconia, LLC

    11,322
    RFQ
    577002B00000G

    Tabla de datos

    - Bag Active Board Level TO-220 Bolt On Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.250" (6.35mm) 1.5W @ 50°C 10.00°C/W @ 500 LFM 32.00°C/W Aluminum Black Anodized
    V2022B

    V2022B

    HEATSINK CPU XCUT

    Assmann WSW Components

    3,673
    RFQ
    V2022B

    Tabla de datos

    - Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.236" (6.00mm) - - 24.00°C/W Aluminum Alloy Black Anodized
    240118ABHE22

    240118ABHE22

    HEATSINK TO-220 TWISTED FIN

    Wakefield-Vette

    3,195
    RFQ
    240118ABHE22

    Tabla de datos

    240 Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.180" (29.97mm) 0.570" (14.47mm) - 0.500" (12.70mm) 4.0W @ 55°C 5.30°C/W @ 400 LFM 13.80°C/W Aluminum Black Anodized
    HSS-B20-NP-12

    HSS-B20-NP-12

    HEATSINK TO-220 6.8W ALUMINUM

    Same Sky (Formerly CUI Devices)

    1,157
    RFQ
    HSS-B20-NP-12

    Tabla de datos

    HSS Bag Active Board Level TO-220 Bolt On Rectangular, Fins 1.450" (36.83mm) 0.700" (17.80mm) - 0.850" (21.60mm) 6.8W @ 75°C 3.47°C/W @ 200 LFM 14.33°C/W Aluminum Black Anodized
    591302B02800G

    591302B02800G

    HEATSINK TO-220 W/INSTALL TAB

    Boyd Laconia, LLC

    27,378
    RFQ
    591302B02800G

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-220, TO-262 Clip and Board Locks Rectangular, Fins 0.750" (19.05mm) 0.500" (12.70mm) - 0.500" (12.70mm) 1.0W @ 30°C 7.00°C/W @ 400 LFM 26.80°C/W Aluminum Black Anodized
    V6560Y

    V6560Y

    HEATSINK ALUM ANOD

    Assmann WSW Components

    12,491
    RFQ
    V6560Y

    Tabla de datos

    - Tray Active Board Level TO-220 Bolt On and PC Pin Rectangular, Fins 1.969" (50.00mm) 1.181" (30.00mm) - 0.472" (12.00mm) - - 7.00°C/W Aluminum Black Anodized
    V5629W220

    V5629W220

    HEATSINK ALUM ANOD

    Assmann WSW Components

    5,741
    RFQ
    V5629W220

    Tabla de datos

    - Bulk Active Top Mount TO-220 Bolt On and PC Pin Square, Fins 0.984" (25.00mm) 0.449" (11.40mm) - 0.260" (6.60mm) - - 36.00°C/W Aluminum Black Anodized
    HSB01-080808

    HSB01-080808

    HEAT SINK, BGA, 8.5 X 8.5 X 8 MM

    Same Sky (Formerly CUI Devices)

    2,653
    RFQ
    HSB01-080808

    Tabla de datos

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.335" (8.50mm) 0.335" (8.50mm) - 0.315" (8.00mm) 1.9W @ 75°C 16.00°C/W @ 200 LFM 39.10°C/W Aluminum Alloy Black Anodized
    V2027B

    V2027B

    HEATSINK CPU XCUT

    Assmann WSW Components

    5,084
    RFQ
    V2027B

    Tabla de datos

    - Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.098" (27.90mm) 1.098" (27.90mm) - 0.441" (11.20mm) - - 19.00°C/W Aluminum Alloy Black Anodized
    HSB03-141406

    HSB03-141406

    HEAT SINK, BGA, 14 X 14 X 6 MM

    Same Sky (Formerly CUI Devices)

    3,329
    RFQ
    HSB03-141406

    Tabla de datos

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.551" (14.00mm) 0.551" (14.00mm) - 0.236" (6.00mm) 2.1W @ 75°C 15.80°C/W @ 200 LFM 35.98°C/W Aluminum Alloy Black Anodized
    272-AB

    272-AB

    HEATSINK TO-220 SM FOOTPRINT BLK

    Wakefield-Vette

    2,177
    RFQ
    272-AB

    Tabla de datos

    272 Bulk Active Board Level TO-220, TO-202 Bolt On and PC Pin Rectangular, Fins 1.450" (36.83mm) 1.750" (44.45mm) - 0.375" (9.52mm) 4.0W @ 42°C 3.60°C/W @ 400 LFM 10.50°C/W Aluminum Black Anodized
    V2020B

    V2020B

    HEATSINK CPU XCUT

    Assmann WSW Components

    1,750
    RFQ
    V2020B

    Tabla de datos

    - Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.551" (14.00mm) 0.551" (14.00mm) - 0.394" (10.00mm) - - 27.00°C/W Aluminum Alloy Black Anodized
    V8813W

    V8813W

    HEATSINK TO-220/TOP-3/SOT-32

    Assmann WSW Components

    1,426
    RFQ
    V8813W

    Tabla de datos

    - Tray Active Board Level, Vertical SOT-32, TO-220, TOP-3 Bolt On and PC Pin Rectangular, Fins 0.984" (25.00mm) 1.359" (34.50mm) - 0.492" (12.50mm) - - 6.50°C/W Aluminum Black Anodized
    HSB18-232310

    HSB18-232310

    HEAT SINK, BGA, 23 X 23 X 10 MM

    Same Sky (Formerly CUI Devices)

    4,224
    RFQ
    HSB18-232310

    Tabla de datos

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.906" (23.00mm) 0.906" (23.00mm) - 0.394" (10.00mm) 3.7W @ 75°C 6.80°C/W @ 200 LFM 20.41°C/W Aluminum Alloy Black Anodized
    V-1100-SMD/A

    V-1100-SMD/A

    HEATSINK TO-263 12.70X26.20MM

    Assmann WSW Components

    1,855
    RFQ
    V-1100-SMD/A

    Tabla de datos

    - Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) SMD Pad Rectangular, Fins 0.500" (12.70mm) 1.031" (26.20mm) - 0.390" (9.91mm) - - 23.00°C/W Copper Tin
    HSE-B20250-040H-01

    HSE-B20250-040H-01

    HEAT SINK, EXTRUSION, TO-220, 25

    Same Sky (Formerly CUI Devices)

    1,145
    RFQ
    HSE-B20250-040H-01

    Tabla de datos

    HSE Box Active Board Level, Vertical TO-220 PC Pin Rectangular, Angled Fins 0.984" (25.00mm) 1.359" (34.50mm) - 0.492" (12.50mm) 5.5W @ 75°C 4.44°C/W @ 200 LFM 13.64°C/W Aluminum Alloy Black Anodized
    506007B00000G

    506007B00000G

    HEATSINK TO-3 LOW PROFILE .375"

    Boyd Laconia, LLC

    3,540
    RFQ
    506007B00000G

    Tabla de datos

    - Bag Active Board Level TO-3 Bolt On Rectangular, Fins 2.000" (50.80mm) 1.750" (44.45mm) - 0.375" (9.52mm) 10.0W @ 70°C 3.00°C/W @ 400 LFM 7.00°C/W Aluminum Black Anodized
    ATS-PCB1025

    ATS-PCB1025

    HEATSINK TO-126 BLACK

    Advanced Thermal Solutions Inc.

    4,414
    RFQ
    ATS-PCB1025

    Tabla de datos

    - Bulk Active Board Level TO-126 Bolt On Rectangular, Fins 0.560" (14.22mm) 0.620" (15.75mm) - 0.370" (9.40mm) - 19.00°C/W @ 200 LFM 33.00°C/W Aluminum Black Anodized
    ATS-PCB1064

    ATS-PCB1064

    HEATSINK TO-220 CLIP-ON BLACK

    Advanced Thermal Solutions Inc.

    1,471
    RFQ
    ATS-PCB1064

    Tabla de datos

    - Bulk Active Board Level TO-220 Clip Rectangular, Fins 0.748" (19.00mm) 0.504" (12.80mm) - 0.500" (12.70mm) - 10.20°C/W @ 200 LFM 27.30°C/W Aluminum Black Anodized
    HSB08-212106

    HSB08-212106

    HEAT SINK, BGA, 21 X 21 X 6 MM

    Same Sky (Formerly CUI Devices)

    1,436
    RFQ
    HSB08-212106

    Tabla de datos

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.236" (6.00mm) 3.0W @ 75°C 9.70°C/W @ 200 LFM 25.40°C/W Aluminum Alloy Black Anodized
    Total 122183 Record«Prev1... 89101112131415...6110Next»
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