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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Disipadores de calor

    制造商 Serie Embalaje Estado del producto Tipo Paquete refrigerado Método de fijación Forma Longitud Ancho Diámetro Altura de la aleta Disipación de energía a aumento de temperatura Resistencia térmica a flujo de aire forzado Resistencia térmica a natural Material Acabado del 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    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Paquete refrigerado Método de fijación Forma Longitud Ancho Diámetro Altura de la aleta Disipación de energía a aumento de temperatura Resistencia térmica a flujo de aire forzado Resistencia térmica a natural Material Acabado del material
    658-35AB

    658-35AB

    HEATSINK CPU 28MM SQBLK W/O TAPE

    Wakefield-Vette

    13,852
    RFQ
    658-35AB

    Tabla de datos

    658 Tray Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.350" (8.89mm) - 3.00°C/W @ 800 LFM - Aluminum Black Anodized
    V2268E1

    V2268E1

    CPU HEATSINK, CROSS CUT, AL6063,

    Assmann WSW Components

    1,929
    RFQ
    V2268E1

    Tabla de datos

    - Bulk Active Top Mount - Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.669" (17.00mm) 0.669" (17.00mm) - 0.236" (6.00mm) - - 30.00°C/W Aluminum Alloy Black Anodized
    HSE-B20254-040H

    HSE-B20254-040H

    HEAT SINK, EXTRUSION, TO-220, 25

    Same Sky (Formerly CUI Devices)

    2,107
    RFQ
    HSE-B20254-040H

    Tabla de datos

    HSE Bag Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.260" (32.00mm) - 0.551" (14.00mm) 5.7W @ 75°C 7.74°C/W @ 200 LFM 13.16°C/W Aluminum Alloy Black Anodized
    HSE-B20250-045H

    HSE-B20250-045H

    HEAT SINK, EXTRUSION, TO-220, 50

    Same Sky (Formerly CUI Devices)

    868
    RFQ
    HSE-B20250-045H

    Tabla de datos

    HSE Box Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.969" (50.00mm) 1.181" (30.00mm) - 0.472" (12.00mm) 7.7W @ 75°C 4.05°C/W @ 200 LFM 9.74°C/W Aluminum Alloy Black Anodized
    V2269E1

    V2269E1

    CPU HEATSINK, CROSS CUT, AL6063,

    Assmann WSW Components

    1,083
    RFQ
    V2269E1

    Tabla de datos

    - Bulk Active Top Mount - Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.787" (20.00mm) 0.787" (20.00mm) - 0.354" (9.00mm) - - 27.00°C/W Aluminum Alloy Black Anodized
    576802B03900G

    576802B03900G

    HEATSINK TO220 CLIPON W/TAB.75"

    Boyd Laconia, LLC

    15,144
    RFQ
    576802B03900G

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-220, TO-262 Clip and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.500" (12.70mm) - 0.500" (12.70mm) 1.0W @ 30°C 7.00°C/W @ 400 LFM 27.30°C/W Aluminum Black Anodized
    7142DG

    7142DG

    HEATSINK TO-220 TIN CLIP-ON 21MM

    Boyd Laconia, LLC

    4,435
    RFQ
    7142DG

    Tabla de datos

    - Bulk Active Board Level TO-220 Clip and Board Locks Rectangular, Fins 0.780" (19.81mm) 0.520" (13.21mm) - 0.515" (13.08mm) 1.0W @ 30°C 8.00°C/W @ 400 LFM 20.30°C/W Copper Tin
    HSB26-343408

    HSB26-343408

    HEAT SINK, BGA, 33.5 X 33.5 X 8

    Same Sky (Formerly CUI Devices)

    524
    RFQ
    HSB26-343408

    Tabla de datos

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 1.319" (33.50mm) 1.319" (33.50mm) - 0.315" (8.00mm) 4.94W @ 75°C 5.30°C/W @ 200 LFM 15.19°C/W Aluminum Alloy Black Anodized
    7173DG

    7173DG

    BOARD LEVEL HEATSINK .375"TO-220

    Boyd Laconia, LLC

    5,532
    RFQ
    7173DG

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.750" (19.05mm) - 0.375" (9.52mm) 1.5W @ 50°C 10.00°C/W @ 200 LFM 25.80°C/W Copper Tin
    658-45AB

    658-45AB

    HEATSINK CPU 28MM SQBLK W/O TAPE

    Wakefield-Vette

    2,642
    RFQ
    658-45AB

    Tabla de datos

    658 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.450" (11.43mm) 3.0W @ 50°C 6.00°C/W @ 200 LFM - Aluminum Black Anodized
    HSE-B250-04H

    HSE-B250-04H

    HEAT SINK, EXTRUSION, TO-220, 25

    Same Sky (Formerly CUI Devices)

    2,215
    RFQ
    HSE-B250-04H

    Tabla de datos

    HSE Box Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 0.984" (25.00mm) 1.378" (35.00mm) - 1.000" (25.40mm) 8.0W @ 75°C 3.26°C/W @ 200 LFM 13.60°C/W Aluminum Alloy Black Anodized
    HSE-B20500-040H

    HSE-B20500-040H

    HEAT SINK, EXTRUSION, TO-220, 50

    Same Sky (Formerly CUI Devices)

    727
    RFQ
    HSE-B20500-040H

    Tabla de datos

    HSE Tray Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Angled Fins 1.969" (50.00mm) 1.378" (35.00mm) - 0.492" (12.50mm) 8.9W @ 75°C 4.85°C/W @ 200 LFM 8.43°C/W Aluminum Alloy Black Anodized
    574902B03300G

    574902B03300G

    HEATSINK TO-220 VERT MNT W/TAB

    Boyd Laconia, LLC

    5,561
    RFQ
    574902B03300G

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-220 Clip and PC Pin Rectangular 1.375" (34.93mm) 0.860" (21.84mm) - 0.395" (10.03mm) 2.5W @ 40°C 6.00°C/W @ 400 LFM 16.00°C/W Aluminum Black Anodized
    651-B

    651-B

    HEATSINK 14-16PIN DIP BLK

    Wakefield-Vette

    1,025
    RFQ
    651-B

    Tabla de datos

    651 Bulk Active Top Mount 14-DIP and 16-DIP Thermal Tape, Adhesive (Not Included) Rectangular, Fins 0.750" (19.05mm) 0.415" (10.54mm) - 0.240" (6.10mm) 0.5W @ 40°C 40.00°C/W @ 300 LFM - Aluminum Black Anodized
    V5619B

    V5619B

    HEATSINK ALUM ANOD

    Assmann WSW Components

    3,025
    RFQ
    V5619B

    Tabla de datos

    - Bulk Active Top Mount 24-DIP Press Fit Rectangular, Fins 1.299" (32.99mm) 0.748" (19.00mm) - 0.189" (4.80mm) - - 48.00°C/W Aluminum Black Anodized
    ATS-PCB1029

    ATS-PCB1029

    HEATSINK TO-220 BLACK

    Advanced Thermal Solutions Inc.

    6,605
    RFQ
    ATS-PCB1029

    Tabla de datos

    - Bulk Active Board Level TO-220 Bolt On Rectangular, Fins 1.000" (25.40mm) 1.551" (39.40mm) - 0.374" (9.50mm) - 6.80°C/W @ 200 LFM 11.00°C/W Aluminum Black Anodized
    V8813Y

    V8813Y

    HEATSINK TO-220/TOP-3/SOT-32

    Assmann WSW Components

    399
    RFQ
    V8813Y

    Tabla de datos

    - Tray Active Board Level, Vertical SOT-32, TO-220, TOP-3 Bolt On and PC Pin Rectangular, Fins 1.969" (50.00mm) 1.359" (34.50mm) - 0.492" (12.50mm) - - 8.80°C/W Aluminum Black Anodized
    HSB11-252518

    HSB11-252518

    HEAT SINK, BGA, 25 X 25 X 18 MM

    Same Sky (Formerly CUI Devices)

    2,722
    RFQ
    HSB11-252518

    Tabla de datos

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.709" (18.00mm) 5.5W @ 75°C 4.50°C/W @ 200 LFM 13.70°C/W Aluminum Alloy Black Anodized
    XL25W-12-12-10

    XL25W-12-12-10

    CERAMIC HEAT SINK 12X12X10MM WHI

    t-Global Technology

    2,324
    RFQ
    XL25W-12-12-10

    Tabla de datos

    XL-25 Bulk Active Heat Spreader Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape Square 0.472" (12.00mm) 0.472" (12.00mm) - 0.394" (10.00mm) - - - Ceramic -
    657-15ABPEN

    657-15ABPEN

    HEATSINK TO-220 W/PINS BLK 1.5"

    Wakefield-Vette

    2,871
    RFQ
    657-15ABPEN

    Tabla de datos

    657 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.500" (38.10mm) 6.0W @ 38°C 3.30°C/W @ 200 LFM - Aluminum Black Anodized
    Total 122183 Record«Prev1... 1011121314151617...6110Next»
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