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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Disipadores de calor

    制造商 Serie Embalaje Estado del producto Tipo Paquete refrigerado Método de fijación Forma Longitud Ancho Diámetro Altura de la aleta Disipación de energía a aumento de temperatura Resistencia térmica a flujo de aire forzado Resistencia térmica a natural Material Acabado del 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    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Paquete refrigerado Método de fijación Forma Longitud Ancho Diámetro Altura de la aleta Disipación de energía a aumento de temperatura Resistencia térmica a flujo de aire forzado Resistencia térmica a natural Material Acabado del material
    HSB25-282810

    HSB25-282810

    HEAT SINK, BGA, 28.5 X 28.5 X 10

    Same Sky (Formerly CUI Devices)

    1,544
    RFQ
    HSB25-282810

    Tabla de datos

    HSB Box Active Top Mount BGA Push Pin Square, Pin Fins 1.122" (28.50mm) 1.122" (28.50mm) - 0.394" (10.00mm) 4.87W @ 75°C 5.10°C/W @ 200 LFM 15.41°C/W Aluminum Alloy Black Anodized
    7139DG

    7139DG

    HEATSINK TO-220 TIN CLIP-ON 13MM

    Boyd Laconia, LLC

    3,129
    RFQ
    7139DG

    Tabla de datos

    - Bulk Active Board Level TO-220 Clip and PC Pin Rectangular, Fins 0.780" (19.81mm) 0.520" (13.21mm) - 0.515" (13.08mm) 1.5W @ 50°C 8.00°C/W @ 500 LFM 28.30°C/W Copper Tin
    531002B00000G

    531002B00000G

    HEATSINK TO-220 BLACK 1"

    Boyd Laconia, LLC

    2,312
    RFQ
    531002B00000G

    Tabla de datos

    - Box Active Board Level, Vertical TO-220, TO-202 Bolt On Rectangular, Fins 1.000" (25.40mm) 1.375" (34.93mm) - 0.500" (12.70mm) 3.0W @ 40°C 4.00°C/W @ 400 LFM 13.40°C/W Aluminum Black Anodized
    529802B00000G

    529802B00000G

    HEATSINK TO-220 10W H=1.5" BLK

    Boyd Laconia, LLC

    8,427
    RFQ
    529802B00000G

    Tabla de datos

    - Box Active Board Level, Vertical TO-220 Bolt On Rectangular, Fins 1.500" (38.10mm) 1.650" (41.91mm) - 1.000" (25.40mm) 8.0W @ 40°C 2.00°C/W @ 500 LFM - Aluminum Black Anodized
    575703B00000G

    575703B00000G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    2,133
    RFQ
    575703B00000G

    Tabla de datos

    - Bulk Active Board Level TO-3 Bolt On Rhombus 1.630" (41.40mm) 1.290" (32.77mm) - 0.750" (19.05mm) 2.0W @ 30°C 4.00°C/W @ 200 LFM 13.40°C/W Aluminum Black Anodized
    6030D(COPPER)G

    6030D(COPPER)G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    432
    RFQ
    6030D(COPPER)G

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 1.0W @ 20°C 6.00°C/W @ 300 LFM 12.50°C/W Copper Tin
    V5220X

    V5220X

    HEATSINK ANOD ALUM W/PIN TO-220

    Assmann WSW Components

    606
    RFQ
    V5220X

    Tabla de datos

    - Tray Active Board Level, Vertical TO-220 Bolt On Rectangular, Fins 1.476" (37.50mm) 1.260" (32.00mm) - 0.787" (19.99mm) - - 8.00°C/W Aluminum Black Anodized
    TGH-0130-03

    TGH-0130-03

    ALUMINIUM HEAT SINK 35X13MM

    t-Global Technology

    297
    RFQ
    TGH-0130-03

    Tabla de datos

    TGH Bulk Active Top Mount - - Rectangular, Fins 1.378" (35.00mm) 0.512" (13.00mm) - 0.236" (6.00mm) - - - Aluminum Black Anodized
    ATS-PCB1074

    ATS-PCB1074

    HEATSINK TO-263 COPPER

    Advanced Thermal Solutions Inc.

    11,043
    RFQ
    ATS-PCB1074

    Tabla de datos

    - Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) - Rectangular, Fins 0.500" (12.70mm) 1.031" (26.20mm) - 0.401" (10.20mm) - 9.50°C/W @ 200 LFM 18.00°C/W Copper Tin
    V2277E1

    V2277E1

    CPU HEATSINK, CROSS CUT, AL6063,

    Assmann WSW Components

    292
    RFQ
    V2277E1

    Tabla de datos

    - Bulk Active Top Mount - Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.394" (10.00mm) - - 26.00°C/W Aluminum Alloy Black Anodized
    576802B03100G

    576802B03100G

    HEAT SINK HORIZ PLUG-IN TO-220

    Boyd Laconia, LLC

    13,633
    RFQ
    576802B03100G

    Tabla de datos

    - Bulk Active Board Level TO-220, TO-262 Clip and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.500" (12.70mm) - 0.500" (12.70mm) 1.0W @ 30°C 7.00°C/W @ 400 LFM 27.30°C/W Aluminum Black Anodized
    625-45AB

    625-45AB

    HEATSINK CPU 25MM SQ H=.45" BLK

    Wakefield-Vette

    2,168
    RFQ
    625-45AB

    Tabla de datos

    625 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.450" (11.43mm) - 8.00°C/W @ 400 LFM - Aluminum Black Anodized
    529701B02500G

    529701B02500G

    HEATSINK TO-218 SOLDER PIN

    Boyd Laconia, LLC

    16,835
    RFQ
    529701B02500G

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-218 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.000" (25.40mm) 12.0W @ 70°C 4.00°C/W @ 200 LFM 5.50°C/W Aluminum Black Anodized
    M47118B011000G

    M47118B011000G

    MAX CLIP HEATSINK

    Boyd Laconia, LLC

    607
    RFQ
    M47118B011000G

    Tabla de datos

    Max Clip System™ Bulk Active Board Level, Vertical TO-126, TO-220, TO-247 Clip and PC Pin Rectangular, Angled Fins 1.180" (29.97mm) 0.764" (19.40mm) - 1.240" (31.50mm) - - - Aluminum Black Anodized
    HSB15-404010

    HSB15-404010

    HEAT SINK, BGA, 40 X 40 X 10 MM

    Same Sky (Formerly CUI Devices)

    202
    RFQ
    HSB15-404010

    Tabla de datos

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.394" (10.00mm) 6.3W @ 75°C 3.90°C/W @ 200 LFM 11.84°C/W Aluminum Alloy Black Anodized
    579103B00000G

    579103B00000G

    HEATSINK TO-3 BLACK .87"

    Boyd Laconia, LLC

    1,075
    RFQ
    579103B00000G

    Tabla de datos

    - Bag Active Top Mount TO-3 Bolt On Rhombus 1.540" (39.12mm) - 1.125" (28.57mm) OD 0.870" (22.10mm) 2.5W @ 40°C 4.00°C/W @ 600 LFM 12.50°C/W Aluminum Black Anodized
    HSS01-B20-CP

    HSS01-B20-CP

    HEAT SINK, STAMPING, TO-220, 49.

    Same Sky (Formerly CUI Devices)

    975
    RFQ
    HSS01-B20-CP

    Tabla de datos

    HSS Box Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular 1.941" (49.31mm) 1.900" (48.26mm) - 0.950" (24.13mm) 9.9W @ 75°C 3.70°C/W @ 200 LFM 7.59°C/W Aluminum Alloy Black Anodized
    HSB14-353518

    HSB14-353518

    HEAT SINK, BGA, 35 X 35 X 18 MM

    Same Sky (Formerly CUI Devices)

    681
    RFQ
    HSB14-353518

    Tabla de datos

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.709" (18.00mm) 8.4W @ 75°C 3.60°C/W @ 200 LFM 8.97°C/W Aluminum Alloy Black Anodized
    TGH-0220-06

    TGH-0220-06

    ALUMINIUM HEAT SINK 27X22MM

    t-Global Technology

    229
    RFQ
    TGH-0220-06

    Tabla de datos

    TGH Bulk Active Top Mount - - Rectangular, Pin Fins 1.063" (27.00mm) 0.866" (22.00mm) - 0.354" (9.00mm) - - - Aluminum Black Anodized
    534202B02853G

    534202B02853G

    HEATSINK TO-220 W/SHURLOCK-CLIP

    Boyd Laconia, LLC

    19,247
    RFQ
    534202B02853G

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-220 Clip and Board Locks Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 1.0W @ 20°C 6.00°C/W @ 300 LFM 13.40°C/W Aluminum Black Anodized
    Total 122183 Record«Prev1... 1112131415161718...6110Next»
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