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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Disipadores de calor

    制造商 Serie Embalaje Estado del producto Tipo Paquete refrigerado Método de fijación Forma Longitud Ancho Diámetro Altura de la aleta Disipación de energía a aumento de temperatura Resistencia térmica a flujo de aire forzado Resistencia térmica a natural Material Acabado del 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    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Paquete refrigerado Método de fijación Forma Longitud Ancho Diámetro Altura de la aleta Disipación de energía a aumento de temperatura Resistencia térmica a flujo de aire forzado Resistencia térmica a natural Material Acabado del material
    530714B00000G

    530714B00000G

    HEATSINK TO-220 LIGHTWEIGHT .5"

    Boyd Laconia, LLC

    1,484
    RFQ
    530714B00000G

    Tabla de datos

    - Bag Active Board Level TO-220 Bolt On Rectangular, Fins 0.710" (18.03mm) 1.000" (25.40mm) - 0.500" (12.70mm) 2.0W @ 40°C 4.00°C/W @ 700 LFM 20.30°C/W Aluminum Black Anodized
    HSB30-373710

    HSB30-373710

    HEAT SINK, BGA, 37.4 X 37 X 10 M

    Same Sky (Formerly CUI Devices)

    172
    RFQ
    HSB30-373710

    Tabla de datos

    HSB Box Active Top Mount BGA Push Pin Square, Pin Fins 1.472" (37.39mm) 1.472" (37.39mm) - 0.394" (10.00mm) 6.45W @ 75°C 4°C/W @ 200 LFM 11.63°C/W Aluminum Alloy Black Anodized
    655-53AB

    655-53AB

    HEATSINK CPU 40.6MM SQ H=.525"

    Wakefield-Vette

    3,411
    RFQ
    655-53AB

    Tabla de datos

    655 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.600" (40.64mm) 1.600" (40.64mm) - 0.522" (13.27mm) 4.0W @ 40°C 2.00°C/W @ 400 LFM - Aluminum Black Anodized
    V2030B

    V2030B

    HEATSINK CPU FORGED

    Assmann WSW Components

    564
    RFQ
    V2030B

    Tabla de datos

    - Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.256" (6.50mm) - - 6.00°C/W Aluminum Alloy Black Anodized
    DV-T268-301E-TR

    DV-T268-301E-TR

    HEATSINK FOR TO-268

    Ohmite

    3,971
    RFQ
    DV-T268-301E-TR

    Tabla de datos

    D Tape & Reel (TR) Active Top Mount TO-268 (D³Pak) Solderable Feet Rectangular, Fins 0.500" (12.70mm) 1.580" (40.13mm) - 0.460" (11.68mm) 7.0W @ 35°C 4.00°C/W @ 700 LFM - Aluminum Degreased
    504222B00000G

    504222B00000G

    HEATSINK TO-220 PWR CLR 1.45"10W

    Boyd Laconia, LLC

    2,583
    RFQ
    504222B00000G

    Tabla de datos

    - Bag Active Board Level TO-220 (Dual) Bolt On Rectangular, Fins 1.450" (36.83mm) 0.780" (19.81mm) - 0.850" (21.60mm) 4.0W @ 40°C 5.00°C/W @ 200 LFM 6.40°C/W Aluminum Black Anodized
    M48118B011000G

    M48118B011000G

    MAX CLIP HEATSINK

    Boyd Laconia, LLC

    6,174
    RFQ
    M48118B011000G

    Tabla de datos

    Max Clip System™ Bulk Active Board Level, Vertical TO-126, TO-220, TO-247 Clip and PC Pin Rectangular, Angled Fins 1.180" (29.97mm) 0.866" (22.00mm) - 1.516" (38.50mm) - - - Aluminum Black Anodized
    HSB16-404018

    HSB16-404018

    HEAT SINK, BGA, 40 X 40 X 18 MM

    Same Sky (Formerly CUI Devices)

    1,049
    RFQ
    HSB16-404018

    Tabla de datos

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.709" (18.00mm) 9.4W @ 75°C 2.60°C/W @ 200 LFM 7.96°C/W Aluminum Alloy Black Anodized
    580100B00000G

    580100B00000G

    HEATSINK SLIDE-ON 8-DIP

    Boyd Laconia, LLC

    574
    RFQ
    580100B00000G

    Tabla de datos

    - Bulk Active Top Mount 8-DIP Press Fit, Slide On Rectangular, Fins 0.562" (14.27mm) 0.600" (15.24mm) - 0.450" (11.43mm) 1.0W @ 30°C 8.00°C/W @ 500 LFM 30.00°C/W Aluminum Black Anodized
    HSB40-252510P

    HSB40-252510P

    HEAT SINK, BGA, 25 X 25 X 10 MM,

    Same Sky (Formerly CUI Devices)

    346
    RFQ
    HSB40-252510P

    Tabla de datos

    HSB Box Active Top Mount BGA Push Pin Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.394" (10.00mm) 4.2W @ 75°C 6.00°C/W @ 200 LFM 17.87°C/W Aluminum Alloy Black Anodized
    576602B00000G

    576602B00000G

    HEATSINK TO-220 VERT MNT .95"

    Boyd Laconia, LLC

    3,037
    RFQ
    576602B00000G

    Tabla de datos

    - Bag Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 0.950" (24.13mm) 1.000" (25.40mm) - 0.500" (12.70mm) 1.0W @ 20°C 9.00°C/W @ 200 LFM 16.60°C/W Aluminum Black Anodized
    TGH-0220-03

    TGH-0220-03

    ALUMINIUM HEAT SINK 22X22MM

    t-Global Technology

    670
    RFQ
    TGH-0220-03

    Tabla de datos

    TGH Bulk Active Top Mount - - Square, Pin Fins 0.866" (22.00mm) 0.866" (22.00mm) - 0.354" (9.00mm) - - - Aluminum Black Anodized
    507222B00000G

    507222B00000G

    HEATSINK TO-220 DUAL 10W

    Boyd Laconia, LLC

    339
    RFQ
    507222B00000G

    Tabla de datos

    Hat Section 5070 Bag Active Board Level TO-220 Bolt On Rectangular, Fins 1.470" (37.34mm) 1.750" (44.45mm) - 0.375" (9.52mm) 8.0W @ 70°C 3.00°C/W @ 200 LFM 9.60°C/W Aluminum Black Anodized
    V4330K

    V4330K

    HEATSINK ANOD ALUM

    Assmann WSW Components

    2,003
    RFQ
    V4330K

    Tabla de datos

    - Bulk Active Board Level KLP Bolt On Rectangular, Fins 1.476" (37.50mm) 1.142" (29.00mm) - 0.472" (12.00mm) - - 11.00°C/W Aluminum Black Anodized
    E2A-T220-38E

    E2A-T220-38E

    BLACK ANODIZED HEATSINK

    Ohmite

    144
    RFQ
    E2A-T220-38E

    Tabla de datos

    EX Bulk Active Board Level, Vertical TO-220 Bolt On and Board Mounts Rectangular, Fins 0.641" (16.28mm) 0.642" (16.30mm) - 1.500" (38.10mm) 3.0W @ 50°C 5.00°C/W @ 200 LFM 14.00°C/W Aluminum Black Anodized
    FA-T220-51E

    FA-T220-51E

    HEATSINK TO-218,TO-220,TO-247

    Ohmite

    1,499
    RFQ
    FA-T220-51E

    Tabla de datos

    F Box Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 2.000" (50.80mm) 1.638" (41.60mm) - 0.984" (25.00mm) 4.0W @ 20°C 2.00°C/W @ 300 LFM 3.40°C/W Aluminum Black Anodized
    V8818V

    V8818V

    HEATSINK ALUM ANOD

    Assmann WSW Components

    488
    RFQ
    V8818V

    Tabla de datos

    - Tray Active Board Level SOT-32, TO-220 Bolt On and PC Pin Rectangular, Fins 2.362" (60.00mm) 0.748" (19.00mm) - 0.844" (21.44mm) - - 7.50°C/W Aluminum Black Anodized
    658-25ABT3

    658-25ABT3

    HEATSINK CPU 28MM SQ BLK W/TAPE

    Wakefield-Vette

    3,605
    RFQ
    658-25ABT3

    Tabla de datos

    658 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.250" (6.35mm) 2.0W @ 40°C 5.00°C/W @ 500 LFM - Aluminum Black Anodized
    HSB17-404025

    HSB17-404025

    HEAT SINK, BGA, 40 X 40 X 25 MM

    Same Sky (Formerly CUI Devices)

    596
    RFQ
    HSB17-404025

    Tabla de datos

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.984" (25.00mm) 11.7W @ 75°C 2.10°C/W @ 200 LFM 6.41°C/W Aluminum Alloy Black Anodized
    HSB27-434316

    HSB27-434316

    HEAT SINK, BGA, 43.1 X 43.1 X 16

    Same Sky (Formerly CUI Devices)

    916
    RFQ
    HSB27-434316

    Tabla de datos

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 1.697" (43.10mm) 1.697" (43.10mm) - 0.650" (16.51mm) 8.98W @ 75°C 2.80°C/W @ 200 LFM 8.35°C/W Aluminum Alloy Black Anodized
    Total 122183 Record«Prev1... 1415161718192021...6110Next»
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